Profile Heat Sink

For forced cooling, Seifert electronic offers compact fan units in various performance classes. The variable fin spacing in the high-performance heat sinks ensures strong cooling during fan operation. In forced convection cooling, fans are required as separate sources of convection. To ensure optimal convection during fan operation, it is recommended to incorporate heat sink profiles. The fin spacing in heat sink profiles is particularly important, as increasing the surface area is key for forced cooling. To push this boundary further, we have continuously reduced the fin spacing in our profiles. Depending on the model, up to three fans per cooler are possible, which can optionally be equipped with pressure chambers for improved air guidance. Most heat sinks are already equipped with aerodynamically designed hollow fins. Additionally, air deflectors for air guidance are available for some heat sink profiles.

Maximum heat dissipation using PC board heat sinks in minimal board space. Seifert electronic GmbH offers custom heat sinks for use in the board area – precisely measured and flexibly adapted to your requirements. The wide standard range of Seifert electronic includes PC heat sinks in all common designs. We provide various heat sink models such as snap-on heat sinks made of strip material, extruded heat sinks, die-cast heat sinks, as well as finger heat sinks and U-shaped heat sinks, along with the corresponding accessories like mounting clips for fastening. Extruded profile heat sinks are considered classics among PC board heat sinks. We gladly recommend them for use in the board area as they are versatile and can dissipate relatively large amounts of heat.

High-performance heat sinks from Seifert electronic are exclusively designed for forced cooling applications. The powerful heat sinks from the Vario and DKL series impress with their large cooling surfaces. Utilizing a finned construction, rib spacing can be manufactured that is not achievable with conventional extruded profiles. Thanks to maximized surface area with the same weight, a high-performance heat sink delivers above-average cooling performance per unit volume. We have patented our proprietary compression geometry at Seifert electronic. In this process, individual fins are precisely cold-pressed into a heat sink without the use of adhesives. Heat conduction in the finned heat sinks occurs directly from the base to the fins, without any thermal transition as seen with pressed-in ribs into a solid base. Custom mounting holes can be incorporated into the pressed, surface-milled base.

For applications involving very high currents and voltages, Seifert electronic provides heat sinks and mounting brackets designed to apply the appropriate pressure for optimal disc cell cooling. Presspack cells are employed in circuits where very high currents and voltages are present. In such scenarios, disc cell cooling is crucial for ensuring good electrical and thermal transfer. Achieving this goal primarily hinges on the connection between individual presspack cells and the heat sinks in disc cell cooling. This connection must be established with the clamping force specified by the manufacturer. With Seifert heat sinks and the accompanying mounting brackets, also known as clamping brackets, we offer professional equipment for maintaining the correct pressure in disc cell cooling applications. This ensures a high level of durability and robustness, contributing to an extended lifespan of the setup.