Advanced assembly technologies
Interconnect technology & electronic manufacturing services (EMS) -  MICRO SYSTEMS TECHNOLOGIES MANAGEMENT AG

Description

automated SMD assembly flip chip and chip scale packages wire bonding technologies - ultrasonic bonding - thermosonic wedge/wedge bonding - thermosonic ball/wedge bonding die attach technologies - gluing - soldering - AuSi eutectic bonding die protection and encapsulation

Additional product literature

Neuhofstrasse 4 6340 Baar
Switzerland
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