China
Manufacturer/ Producer
China
PCB board is also called printed circuit board, it can realize the mutual connection between electronic components. PCB board can be used in different industries of electronic products, it plays an important role. So what are the components of the PCB board? PCB circuit board is composed of: pattern, dielectric, through hole, solder resistant , silk screen and surface Finish.
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The four-layer PCB board is pressed on the basis of the double-sided PCB board (two-layer PCB board), and PP and copper foil are added to both sides of the double-sided PCB board when pressed, and then pressed into a 4 layers PCB board after high temperature and high pressure. To put it simply, the four-layer PCB board has an inner layer. In terms of process, some circuits are etched onto the inner layer and then pressed.
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Multilayer PCB circuit board is a kind of printed circuit board composed of alternating conductive pattern layer and insulating material laminated.
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Simply put, Immersion Gold PCB uses a chemical deposition method to produce a layer of metal plating on the surface of the circuit board through chemical redox reactions.
Request for a quoteShijiazhuang Linke Electronics Tech Co., Ltd is a high tech company that offers One-Stop services of PCB and PCB assembly.Our services include PCB design, PCB manufacture, PCB Assembly, Components sourcing, Stencils and PCBA testing.We have been focusing on PCB and PCBA OEM services for more than 14 years, and we have rich experience to manufacture high quality products and supply good services. Linke Electronics was established in 2004, we have state-of-the-art equipment and professional workers.Our factory is ISO 9001: 2015, ROHS and UL certified.All the products delivered from Linke Electronics are quality guaranteed with ISO and UL certification.Under such quality guarantees, our products are popular both at home and abroad.They are widely applied to Telecommunications, Industrial Control, Medical, Security System, Electricity, Automotive, Computers and etc. Linke Electronics is willing to build business relationships with customers both at home and abroad.Our principles are: ”Be professional, Be honest, Be creative and Be responsible”.We warmly welcome you to visit our factory.
Manufacturer/ Producer
NO.558,Gongnong Road,Qiaoxi District
050051 Shijiazhuang - China
China
Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid
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Our services •Layout creation •Material procurement •SMD assembly •Manual and semi-automatic •Mounting •Reflow and wave soldering •Selective soldering •Automatic Optical Inspection (AOI) •X-ray inspection •System assemblies •In circuit tests and •Function test •Revision and repair •Rework Station •Short delivery times
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Technical data •Max. Panel size up to 1500mm x 670mm •PCB thickness from 0.1-17.5mm •Smallest hole 0.075mm •Smallest trace/spacing 50µm •Copper layer up to 1000µm •Number of layers up to 58 •Aspect Ratio 20:1 •Rigid flex and flex •Viaplugging •Impedance control •Laser Microvias •Blind, Buried Vias Basic material •FR4, FR4 High TG, FR4 •halogen-free, CEM1/3, Rogers, •Ceramic (Al2O3), polyimide and others Surface •HAL lead-free, HAL Pb/Sn, chem. Ni/Au (ENIG), chem. Ni/Pd/Au (ENEPIG), chem. Sn, chem. Ag, OSP(Entek), galv. Ni/Au, Carbon, Ag/Pt (thick film technology) and others Solder resist and placement printing •Different paint systems (including halogen-free) and colors Standards •ISO 9001:2015 / IATF 16949 •UL listing •RoHS / REACH •Manufacturing according to IPC A600 class 2 and 3 Delivery times •Rush service from 1 AT •Series from 10 AT Data preparation •Legacy document preparation •Scan Service •Data conversion •CAM data preparation •CAD layout service
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PCB depanelization is a process step in the production of large-scale assembly of electronics. To increase the throughput of printed circuit board (PCB) and surface mount (SMT) production lines, printed circuit boards are often designed to consist of many smaller individual printed circuit boards that will be used in the final product. This PCB cluster is called a panel or multi-block. The large panel is broken or "depanellated" as a process step - depending on the product, this can be right after the SMT process, after the in-circuit test (ICT), after soldering through-hole components, and even just before the final assembly of the PCBA in the enclosure.
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