Chip on Board (COB)
Enables precision in the smallest spaces
Description
RAFI Eltec has over 20 years of experience in the special technology chip-on-board. That gives us a profound understanding of processes and quality in the standard technologies and beyond. As a result, we meet your requirements for flexible and reliable implementation of technically sophisticated solutions. We even set new standards. CHIP-ON-BOARD TECHNOLOGIES • Chip-on-board bonding • Chip-on-chip bonding • Chip-on-flex bonding • Flip chip TECHNOLOGIES IN THE CLEAN ROOM • Die bonding • Wire bonding (aluminum wire bonding and gold wire wedge-wedge bonding) • Glob top casting • Optical casting • Application of HF seals
- Electrical & Electronic Components
- Chip on flex bonding
- Chip on chip bonding
- Chip on board bonding
Product characteristics
- Chip-On-Board Technologies
- Chip-on-board bonding, Chip-on-chip bonding, Chip-on-flex bonding, Flip chip
- Technologies in the clean room
- Die bonding, Wire bonding (aluminum wire bonding and gold wire wedge-wedge bonding), Glob top castin
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Place of Origin: China Base Material: FR-4 Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.8mm Min. Hole Size: 0.1mm Min. Line Width: 0.065mm Min. Line Spacing: 0.065mm Surface Finishing: HASL Application: Electronics Device Type: Customizable Solder mask: Black Material: FR4 CEM1 CEM3 height TG Color: Red Blue Green Black Testing Service: 100% Supply Ability: 25000 Square Meter/Square Meters per Month
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