Datapaq EasyTrack3 Thermal Profiling System

The Datapaq AutoPaq is a customized thermal profiling system for temperature monitoring of paint, adhesive and sealant cure processes used in the automotive assembly market. Offering up to 20 channels of measurement in a single system, the AutoPaq is the perfect tool for performing detailed cure validation of new installations or optimizing existing lines for new models. With real time RF capability, the system may also be the preferred choice for routine live monitoring of paint operations as part of standard QA procedures. For detailed information and specifications, download the AutoPaq brochure. To learn how the AutoPaq can benefit your operation, download the 3 Key Wins document. Datapaq CoilPaq Thermal Profiling System The Datapaq CoilPaq is used in surface coating lines to monitor the temperature profile of the coil strip at various points across its width, as it is fed through the oven. The design of the CoilPaq allows you to place this instrument

Customers worldwide use Datapaq® temperature profiling and monitoring systems with their powder coating equipment in automotive and industrial powder coating to optimize product quality, reduce waste and prove compliance with ISO9000. When standard and specialty systems will not meet your exact application requirements, Datapaq will build a custom system using Insight™ thermal profiling software, an extensive range of custom barriers and thermocouples, as well as the Datapaq DP5 and Datapaq TP3 data loggers. In addition, Datapaq offers a complete thermal profiling system for real-time data analysis -TM21 Radio Telemetry System. Oven Tracker Insight Software Datapaq powerful Insight analysis software has been designed specifically to convert raw temperature data into meaningful information that can be used to understand, control and optimize your cure process. Complex calculations are simplified, allowing quick and comprehensive analysis.

Datapaq® offers the Oven Tracker® XL2 System, the latest generation of Oven Tracker systems for robust, comprehensive, intelligent and easy-to-use oven temperature profiling. For detailed information, download the Oven Tracker XL2 product brochure. Insight Oven Tracker Thermal Profiling Software Datapaq powerful Insight analysis software has been designed specifically to convert raw temperature data into meaningful information that can be used to understand, control and optimize your cure process. Complex calculations are simplified, allowing quick and comprehensive analysis. Detailed information of your oven gives you the reporting power you need in a detailed, certified and traceable profile report at the click of a button.Routine oven profiling has never been quicker, easier or more efficient. Send the Datapaq XL2 system through the oven and discover the true potential of your finishing operation. Simply 'plug & go' Easy data download from the MemoryPaq

The Datapaq® Reflow Tracker® temperature profiling system travels through the process, enabling you to monitor wave and reflow soldering, as well as vapor phase, selective soldering and rework stations. Comprised of specifically designed thermocouples, data loggers, protective thermal barriers and Insight software, this system will help you optimize product quality, expedite process setup, increase yields and minimize the need for rework. For more details and specifications, download the Reflow Tracker System brochure. Insight Software for Reflow Tracker available in Basic, Standard and Professional versions Insight software is an easy-to-use analysis package designed by Datapaq to meet the needs of the electronics assembly industry. With a typical reflow soldering profile lasting only six minutes, users don't want to spend additional time analyzing the profile. Insight Software ensures that the user is presented with a detailed analysis immediately and it comes