Dymax Low Shrink® OP-81-LS

Low shrinkage optical camera module adhesive with LED and/or heatcure for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. Features: - Rapid LED or UV/Visible light and/or heat cure - Very low volumetric shrinkage - High Tg and Low CTE - Low ASTM E595 Outgassing - No frozen storage, refrigerated shipment/storage 15°C [3441° F]

Dymax GA140 forminplace (FIP) and cureinplace (CIP) gasketing resin is formulated for fuel cell, automotive door handle, appliance housing, and critical electronic assembly and device applications which require a soft, tackfree, lowoutgassing, flexible gasket with compression set. Features: - Cures with UV/Visible light - Low outgassing - Cures soft and tack free - Excellent tear resistance - Clear in color - Cures in seconds - Silicone free - Conforms to intricate channels or recesses - Compliant with with RoHS directives 2015/863/EU

Plating, grit blast, and heatresistant Maskant with SeeCure Technology. Features: - Cures with UV/Visible light - See Cure dispenses blue, cures pink upon cure - Excellent surface protection - Complete under in 8 seconds - Easy peeloff after exposure to heat/hot water bath - Spray or dip application - Rolls Royce approval as metal spray maskant with designation of OMat 2/240 - Compliant with ISO 109935 Cytotoxicity - Compliant with with RoHS2 directives 2015/863/EU

Dymax Ultra LightWeld® 9501F is a UV/Visible lightcuring adhesive optimized for electric vehicle battery potting and bonding. Features: - Cure using UV/Visible light or LED - 385 nm LED Curing - Blue Fluorescing technology for bond line inspection - One part formulation – no mixing - Solvent free Excellent adhesion to metals & plastics