EM TIC 3X - Ion beam slope cutter
Ion Beam Milling System Leica EM TIC 3X -  LEICA MICROSYSTEMS

Description

The Triple Ion Beam Milling System, Leica EM TIC 3X allows production of cross sections and planed surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations. With the Leica EM TIC 3X you achieve high quality surfaces of almost any material at room temperature or cryo, revealing the internal structures of the sample in a near native state as possible.

Milling - steels and metals
ion beam miller - 

Additional product literature

Ernst-Leitz-Strasse 17-37, 35578 Wetzlar
Germany
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