Kapton® and polyimide films with Silicone adhesive. They have been used in applications at temperatures as low as -269°C (-452°F) and as high as 260°C (500°F). high performance, reliability and durability, with a unique combination of electrical, thermal, chemical and mechanical properties that withstand extreme temperature, vibration and other demanding environments. Kapton® polyimide films make innovative design solutions possible in a range of industries including, consumer electronics, solar photovoltaic and wind energy, aerospace, automotive and industrial applications. Kapton® Tapes have a high dielectric strength. Silicon adhesive protection leaves no residue. Custom sizes are available upon request. Applications: Automotive sensor and manifolds Insulating circuit boards Etching Fiber Optics Cable High temperature powder coating Semiconductor manufacturing Wave soldering during circuit board
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High performance heat reflective aluminium backed glass cloth, single coated with a high temperature pressure sensitive silicone adhesive. Thickness:0.2mm; silver Very good temperature resistance.SAE J2302 Thermal Effectiveness at 550°C is 107°C (other testing results available on request).High tensile strength.Halogen-free.Lead-free.Conforms to European Directives 2000/53/EC for End of Vehicle Life (ELV) recycling (does not contain heavy metals) and 2002/95/EC (RoHS).Excellent chemical compatibility with most materials used in components for wiring.
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BASED ON A POLYIMIDE FILM, WHICH EXHIBITS OUTSTANDING TEMPERATURE RESISTANCE AS WELL AS EXCELLENT MECHANICAL AND ELECTRICAL PROPERTIES. RADIATION RESISTANT. SHORT TERM HEAT RESISTANCE UP TO 400C. APPLICATIONS : INSULATION TAPE FOR VERY HIGH TEMPERATURES. FOR HIGH STRESS CONDITIONS IN TRACTION MACHINE MANUFACTURING. GENERATOR PRODUCTION. OUTER WRAP FOR TRANSFORMERS, TORROIDAL COILS, MOTOR COILS AND BUNDLING OF ARMATURE COILS.
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BASED ON POLYIMIDE FILM COATED WITH A SPECIAL SURFACE CONDUCTIVE ADHESIVE. STATIC GENERATION DURING ROLL UNWIND AND TAPE APPLICATION IS ELIMINATED. IT CAN WITHSTAND WAVE SOLDER TEMPERATURES UP TO 300C AND LEAVES NO ADHESIVE RESIDUE ON PRINTED CIRCUIT BOARDS UPON REMOVAL.
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