LTCC (low temperature co-fired ceramic) substrates
Interconnect technology & electronic manufacturing services (EMS) -  MICRO SYSTEMS TECHNOLOGIES MANAGEMENT AG

Description

stacking of 2 layers up to more than 20 layers embedding of passive components such as capacitors, inductors and resistors mounting of frames, metal plates or pins by soldering mechanical processing by laser cutting or machining

Additional product literature

Neuhofstrasse 4 6340 Baar
Switzerland
Request a quote
  • Max. 3000 characters

  • Your address details
  • I agree to the EUROPAGES  terms and conditions and  privacy policy

  • Click to see
OTHER PRODUCTS FROM THIS COMPANY