Peter Wolters DW 292 - Multi Wire SAW

After the surface grinding, the crystal is sliced into wafers with a thickness according to customer’s specifications. Sawing machines with diamond impregnated blade are used for the slicing. We have got 5 sawing machines with a monthly capacity 2500 kg. Maximum diameter Ф152 mm. Wafer thickness up to 80 mm. Slicing accuracy ± 25 microns.

There are many good reasons to separate tubes chiplessly. And first of all, of course, the cleanliness. Precision and output, too, are not insignificant. Our chipless orbital cutting machines make precise cutting results possible. Your tubes can be formed immediately afterwards. That saves time and money. Technical specifications: Separation efficiency: max. Ø 28 x 2 mm for stainless steel tubes Shortest separation length: — 25 mm (without pull apart) — 55 mm (with pull apart) Separation efficiency: up to 2,000 pcs per hour

When it comes to a high quality IR Cut filter, it is the substrate with the coating applied that affects the performance. Knight Optical provide high quality wafers for precisely this, and the surface quality of our substrates eliminates blotching at the sensor which occurs on lower quality substrates especially where IR Cut filters are concerned. Our wafers are produced as thin as 500μm & provide exceptional surface quality. However, we can manufacture to a fully customised specification with a wafer thickness as little as 10 μm. Our substrates for stock or custom can be manufactured from a great deal of materials including: •Quartz •Borosilicate •BK7 or equivalent •Sapphire •And many more. Depending on your application for the IR Cut Filter, we can help advise on the best achievable optic for your application. Please read PDF for full specification