Printed circuit boards and chip packaging substrates
Interconnect technology & electronic manufacturing services (EMS) -  MICRO SYSTEMS TECHNOLOGIES MANAGEMENT AG

Description

highly complex HDI/microvia substrates in flex. rigid-flex and rigid technology high-frequency and high-temperature applications microfluidic substrates comprehensive range of base materials, constraining materials and surface finishes enhanced features such as embedded passives, wrap-around, cavities chip-on-flex (COF) and chip scale packaging (CSP) substrates LCP (Liquid Crystal Polymer) substrates

Additional product literature

Neuhofstrasse 4 6340 Baar
Switzerland
Request a quote
  • Max. 3000 characters

  • Your address details
  • I agree to the EUROPAGES  terms and conditions and  privacy policy

  • Click to see
OTHER PRODUCTS FROM THIS COMPANY