Production Technological Parameters
- Electric and electronic components - machines for manufacturing
- Technological Parameters
Product characteristics
- Maximum customer format – double sided PCBs
- 560 X 360 mm
- Maximum customer format – single sided PCBs
- 570 x 370 mm
- Minimum distance between conductor and board edge
- 0.5 mm
- Minimum distance between tracks
- 0.15 mm
- Minimum track width
- 0.15 mm
- Minimum annular ring width (radius)
- 0.2 mm
- Minimum diameter of plated hole
- 0.3 mm
- Minimum diameter of unplated hole
- 0.4 mm
- Permissible offset between copper layer and drilling
- 0.15 mm
- Permissible offset between solder resist and copper layer
- 0.1 mm
- Permissible offset between legend and drilling
- 0.3 mm
- Permissible offset peelable mask and drilling
- 0.3 mm
- Permissible offset carbon paste and drilling
- 0.3 mm
- Scoring line width (laminate thickness 1,55 mm)
- <= 0.6 mm
- Scoring line relative position to nominal position shift
- ±0.2 mm
- Upper and lower scoring line shift
- ±0.1 mm
- Routed dimensions tolerances
- ±0.20 mm
- Minimum distance between routing and conductor
- 0.30 mm
- Solder resist thickness on copper
- from 8 to 45 µm
- HASL tin thickness
- from 1 to 40 µm
- ENIG gold and nickel thickness
- Au from 0.05 to 0.125 μm Ni from 3.0 to 10 μm
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