RE200-C3

Prototyping Boards Dual Inline
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Description

Fibre-glass CEM3 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 38 x 61 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

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20537 Hamburg - Germany

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