RE434-LF

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Hot air leveling (HAL-leadfree) SMD hole spacing 1.27 x 1.27 mm 113 x 76 soldering pads 1.00 x 1.00 mm (8588 soldering pads) Hole diameter 0.35 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Sn SMD hole spacing 1.27 x 1.27 mm 108 x 69 soldering pads 1.00 x 1.00 mm (7452 soldering pads) 4 potential strips Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

Epoxy fibre-glass FR4 0.80 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Sn SMD hole spacing 1.27 x 1.27 mm 40 x 60 soldering pads 1.00 x 1.00 mm Hole diameter 0.35 mm 2 grids 2.54 x 2.54 mm (1/20") 17 x 32 and 18 x 32 soldering pads 2.00 x 2.00 mm Hole diameter 1.00 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm

Epoxy fibre-glass FR4 0.80 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Sn SMD hole spacing 1.27 x 1.27 mm 39 x 59 soldering pads 1.00 x 1.00 mm Hole diameter 0.35 mm Size 53 x 95 mm