ROTH ELEKTRONIK GMBH

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Without holes Size 100 x 160 mm

SRBP paper FR2 1.50 mm No Cu Hole spacing 2.54 x 2.54 mm 38 x 61 holes with 1.00 mm Ø Size 100 x 160 mm

SMD-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 27 x 27 soldering pads 1.00 x 1.00 mm Hole spacing 1,27 x 1,27 mm Hole diameter 0.45 mm Size 39.37 x 38.10 mm

SMD-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) Solder stop mask 51 x 52 soldering pads 1.00 x 1.00 mm Hole spacing 1,27 x 1,27 mm Hole diameter 0.45 mm Size 70.48 x 68.58 mm

SMD-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 75 x 75 soldering pads 1.00 x 1.00 mm Hole spacing 1,27 x 1,27 mm Hole diameter 0.45 mm Size 99.06 x 99.69 mm

DIL-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 14 x 14 soldering pads 2.00 x 2.00 mm Hole spacing 2.54 x 2.54 mm Hole diameter 1.00 mm Size 40.00 x 40.50 mm

DIL-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 25 x 25 soldering pads 2.00 x 2.00 mm Hole spacing 2.54 x 2.54 mm Hole diameter 1.00 mm Size 67.94 x 68.58 mm

DIL-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 37 x 38 soldering pads 2.00 x 2.00 mm Hole spacing 2.54 x 2.54 mm Hole diameter 1.00 mm Size 100.97 x 99.06 mm

SRBP paper FR2 1.50 mm Single-sided 35 µm Cu Organic soldering protection (OSP) Hole spacing 2.54 x 2.54 mm 37 x 56 soldering pads 2.10 mm Ø Hole diameter 1.00 mm Connector 32/64/96-channel DIN 41612 type C Size 100 x 160 mm