Semiconductor packaging
Semiconductor technology -  MICRO SYSTEMS TECHNOLOGIES MANAGEMENT AG

Description

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types. The newest technology development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) in small and medium-sized volumes applying transfer molding technology, laser marking and singulation.

Additional product literature

Neuhofstrasse 4 6340 Baar
Switzerland
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