VersaSolder

Description

VersaSolder uses selective laser soldering for applications where other methods fail. A laser beam heats an area without impacting the surrounding the key advantage of this non-contact joining technique.A lens assembly focuses the laser power which melts the solder onto the working area. It is tailored exactly to the specific shape of the solder joint and the beam may be circular, elliptic or a straight line. An optional pyrometer measures the temperature in the melt pot and the electronic actively regulates the power profile. Multiple solder heads heat various areas at the same time and a symmetrical arrangement reduces shift. In order to achieve higher productivity, nanosystec developed the Multi Beam Optic (MBO). It generates a number of sub beams processing more than one connection in the same time – up to 40 individual spots have been demonstrated.