Wafer Production Line machines

After the surface grinding, the crystal is sliced into wafers with a thickness according to customer’s specifications. Sawing machines with diamond impregnated blade are used for the slicing. We have got 5 sawing machines with a monthly capacity 2500 kg. Maximum diameter Ф152 mm. Wafer thickness up to 80 mm. Slicing accuracy ± 25 microns.

Knives and blades for food processing fish, meat, chicken, vegetables and fruits

Radiant or convection burner Versatile shapes Flat or cylindrical shape High modulation capacity Homogeneous combustion Single or multi-zone burner Rapid ignition Rapid cooling High durability: reduced maintenance costs Low CO and NOx emissions Eratec can supply the integrated combustion system comprising the infra-red emitter heads as well as the gas premixing system, gas circuit and controls. We can assist you from design to manufacture, during installation and commissioning.