wafers

After the surface grinding, the crystal is sliced into wafers with a thickness according to customer’s specifications. Sawing machines with diamond impregnated blade are used for the slicing. We have got 5 sawing machines with a monthly capacity 2500 kg. Maximum diameter Ф152 mm. Wafer thickness up to 80 mm. Slicing accuracy ± 25 microns.

These products are baked through an entirely automated tunnel type oven. Production machines: From 3500 waffles per hour.

Lotus Biscoff Biscuits Lotus Biscoff Spread Lotus Biscoff Lotus Biscoff Snack Lotus Biscoff Classic Lotus Biscoff Crunchy