95 96 Alumina Ceramic Laser Cutting Drilling Substrate

Ceramic Laser Cutting Drilling Substrate
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Description

The Aluminum oxide (Al2o3 96%) ceramic substrate are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. The Maximum dimension of ceramic plate is 138x138mm and the thickness of ceramic plate ranges from 0.25 to 1.0mm. Alumina Ceramic Substrate Features: > High reliablility and sfety; > High density and mechanical properties > High electrical and thermal loading perormances > Low dilelectic loss and other characteristics Alumina ceramic substrate / plate specification: 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc. Can be made according to your requirements.

  • Ceramics, industrial
  • Ceramic Substrate
  • Ceramic Laser Cutting Substrate
  • Alumina Ceramic Sheet

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361006 Xiamen - China

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