SEIFERT ELECTRONIC GMBH - Individual heat sinks for electrical components

Maximum heat dissipation using PC board heat sinks in minimal board space. Seifert electronic GmbH offers custom heat sinks for use in the board area – precisely measured and flexibly adapted to your requirements. The wide standard range of Seifert electronic includes PC heat sinks in all common designs. We provide various heat sink models such as snap-on heat sinks made of strip material, extruded heat sinks, die-cast heat sinks, as well as finger heat sinks and U-shaped heat sinks, along with the corresponding accessories like mounting clips for fastening. Extruded profile heat sinks are considered classics among PC board heat sinks. We gladly recommend them for use in the board area as they are versatile and can dissipate relatively large amounts of heat.

Seifert heat sinks are designed for both natural and forced cooling applications. From standard heat sinks to individually machined custom profiles, we offer the appropriate heat sink in the desired profile. The standard heat sinks from Seifert electronic GmbH are classic finned heat sinks, primarily intended for natural cooling. However, these heat sinks can also be utilized for forced cooling with airflow. Thanks to the extensive variety of profiles in our standard range, we can fulfill almost any heat sink requirement. From small transistor coolers to profile giants for IGBT cooling, measuring up to 900 mm in width, we provide the right profile for nearly every application. In addition to our standard profiles, we have access to open profiles, offering the possibility of further variations without incurring tooling costs.

High-performance heat sinks from Seifert electronic are exclusively designed for forced cooling applications. The powerful heat sinks from the Vario and DKL series impress with their large cooling surfaces. Utilizing a finned construction, rib spacing can be manufactured that is not achievable with conventional extruded profiles. Thanks to maximized surface area with the same weight, a high-performance heat sink delivers above-average cooling performance per unit volume. We have patented our proprietary compression geometry at Seifert electronic. In this process, individual fins are precisely cold-pressed into a heat sink without the use of adhesives. Heat conduction in the finned heat sinks occurs directly from the base to the fins, without any thermal transition as seen with pressed-in ribs into a solid base. Custom mounting holes can be incorporated into the pressed, surface-milled base.

For forced cooling, Seifert electronic offers compact fan units in various performance classes. The variable fin spacing in the high-performance heat sinks ensures strong cooling during fan operation. In forced convection cooling, fans are required as separate sources of convection. To ensure optimal convection during fan operation, it is recommended to incorporate heat sink profiles. The fin spacing in heat sink profiles is particularly important, as increasing the surface area is key for forced cooling. To push this boundary further, we have continuously reduced the fin spacing in our profiles. Depending on the model, up to three fans per cooler are possible, which can optionally be equipped with pressure chambers for improved air guidance. Most heat sinks are already equipped with aerodynamically designed hollow fins. Additionally, air deflectors for air guidance are available for some heat sink profiles.

For applications involving very high currents and voltages, Seifert electronic provides heat sinks and mounting brackets designed to apply the appropriate pressure for optimal disc cell cooling. Presspack cells are employed in circuits where very high currents and voltages are present. In such scenarios, disc cell cooling is crucial for ensuring good electrical and thermal transfer. Achieving this goal primarily hinges on the connection between individual presspack cells and the heat sinks in disc cell cooling. This connection must be established with the clamping force specified by the manufacturer. With Seifert heat sinks and the accompanying mounting brackets, also known as clamping brackets, we offer professional equipment for maintaining the correct pressure in disc cell cooling applications. This ensures a high level of durability and robustness, contributing to an extended lifespan of the setup.

Our thermal management and insulation products are far from being just interim solutions. The Thermal Interface Materials (TIM) from Seifert electronic GmbH ensure optimal thermal connection between heat sinks and the components to be cooled. As electronic assemblies become increasingly compact, even a tiny gap between individual components can disrupt the necessary heat dissipation. Air pockets between the heat sink and the component being cooled hinder the optimal thermal connection. Possible consequences include temperature overload, which can lead to overheating in the worst-case scenario. Thermal management and insulation products act as connectors between the heat sink and the electronic component being cooled. They fill every tiny gap between the heat sink and semiconductor with thermally conductive material. This ensures optimal thermal connection and prevents any heat buildup.