Chip test - Import export

The troubleshooter for energy supply systems in the chip area - available in 4 sizes. Chips and dirt can affect the service life of cables and hoses significantly. With the RX system, igus® offers an extremely tight plastic e-tube that is nonetheless very easy to open. Snap-open in the outer radius A smooth, curved outer contour prevents chips from sticking Injection-molded "sealing lips" all around No holes, cracks, undercuts Series RX40 is IP40 tested (TÜV Saarland) Interior separation and guide trough available Covered pin/hole connection and stops "RBR" version with bending radius on both sides available Typical branches of industry Machine tools All applications in the direct chip sector Applications exposed to dust and dirt General mechanical engineering Dimensions and technical datas RX e-tubes RX32 Inner height hi: 42 mm Inner widths Bi: 80mm Bending radii R: 80 - 250 mm Pitch: 32 mm RX E-Tube RX40 Inner height hi: 52 mm Inner widths Bi: 100 mm bending radii R: 100 - 300 mm Pitch: 40 mm RX E-Tube RX48 Inner height hi: 62 mm Inner widths Bi: 120mm Bending radii R: 120 - 325 mm Pitch: 48 mm RX E-Tube RX56 Inner height hi: 73 mm Inner widths Bi: 140mm Bending radii R: 140 - 350 mm Pitch: 56 mm RX E-Tube RX56 High-temperature plastic version of the chip-proof RX energy tubes from stock - 850°C from 24h RX - from stock against hot chips red dot 2011: honourable mention for RX40 iF-Design-Award for RX e-tubes ESD classification: Electrically conductive ESD/Atex versions on request UL94-V0 classification on request e-tubes available as special design with HT material for 850°C hot chips The troubleshooter for energy supply systems in the chip area - available in 4 sizes. Chips and dirt can affect the service life of cables and hoses significantly. With the RX system, igus® offers an extremely tight plastic e-tube that is nonetheless very easy to open. Snap-open in the outer radius A smooth, curved outer contour prevents chips from sticking Injection-molded "sealing lips" all around No holes, cracks, undercuts Series RX40 is IP40 tested (TÜV Saarland) Interior separation and guide trough available Covered pin/hole connection and stops "RBR" version with bending radius on both sides available Typical branches of industry Machine tools All applications in the direct chip sector Applications exposed to dust and dirt General mechanical engineering Dimensions and technical datas RX e-tubes Chip tests in the igus® laboratory demonstrate the tremendous chip-proof properties of the igus® RX tube. Chip-proof - for all types of chips and applications RX32 Inner height hi: 42 mm Inner widths Bi: 80mm Bending radii R: 80 - 250 mm Pitch: 32 mm RX E-Tube RX40 Inner height hi: 52 mm Inner widths Bi: 100 mm bending radii R: 100 - 300 mm Pitch: 40 mm RX E-Tube RX48 Inner height hi: 62 mm Inner widths Bi: 120mm Bending radii R: 120 - 325 mm Pitch: 48 mm RX E-Tube RX56 Inner height hi: 73 mm Inner widths Bi: 140mm Bending radii R: 140 - 350 mm Pitch: 56 mm RX E-Tube RX56 High-temperature plastic version of the chip-proof RX energy tubes from stock - 850°C from 24h RX - from stock against hot chips Submersion test in water - Various tube types were submerged under water. The new RX tube needs over 30 seconds until it is filled up, thus proving its high leak tightness Y = time in seconds A = igus® products B = competitor Chip penetration test - Various types of tube were exposed to a defined quantity of chips. In the new RX tube, after 80,000 cycles only 0.2 g of chips were found in the interior Y = chip mass [g] A = igus® RX e-tube RX40.100.100 251.900 cycles B = igus® e-tubes 68.10.100.0 256.132 cycles C = test tube 01 250.907 cycles D = test tube 02* 2.600 cycles *Teststop after 2.600 cycles E = igus® products F = competitor E-Chain® selection aids You can find the right E-Chain® quickly by entering concrete parameters and with the aid of a comparison table. Productfinder Assembly instruction Dismantling / assembling a cover, replacing a chain link and assembling / inserting the RX tube. Assembly instruction Configure interior separation Define cables, select chain and configure interior separation. Now also for RX tubes! Interior separation configurator Application examples Applications in various industrial sectors. RX tubes Series RX - new chip-proof design, small pitch, removable cover 1 Chip-proof design without undercuts and edges 2 Excentric locking 3 Material igumid G 4 rounded shape 5 covered pin/hole connection RX tubes IP tested Technical report TÜV NORD red dot 2011: honourable mention for RX40 iF-Design-Award for RX e-tubes ESD classification: Electrically conductive ESD/Atex versions on request UL94-V0 classification on request e-tubes available as special design with HT material for 850°C hot chips

The PowerTest is a sophisticated testing and encoding system for chip modules on 35 mm tapes. Maximum flexibility allows versatile use: It can be used by card manufacturers for the incoming inspection or encoding of chip module tapes, and with integrated disconnect station by module tape manufacturers as a quality measurement system for the inspection of outgoing goods. Testing of contact, contactless and Dual Interface IC modules can be executed with the highest performance and yield by processing of up to 128 modules in parallel. In addition to basic test and parameter test, software is also available for chip module initialisation, personalisation, and OS loading. Integration of SAM, HSM, or similar modules can be realised easily. Using high-end reader technology from Smartware or Micropross, this automatic IC module test handler offers unmatched performance for the complete production test of smart card and RFID modules. Flexible reel to reel system for high-speed test,...

NanoTest VCSEL measures VCSEL on wafer level or Chip on Carrier regarding their optical and electrical characteristics. The tester accommodates wafers with a diameter of up to 6 inches (150 mm), as an option also larger diameters can be integrated. A special interface mounted to the chuck also allows for testing Chip on Carrier devices.A high-precision motion system with XYZ and rotary adjustment brings the wafer chuck in the respective measurement position. First, electrical contacting takes place supported by a sideview camera. A high-precision current source delivers the operating current for the VCSEL under test.

Encapsulation is the method for protecting the chip and wires against mechanical stress and environmental influences. For this purpose, cast resin is dispensed and then cured by UV light or heat, depending on the type of resin. The PowerSeal offers highest quality and maximum speed for the encapsulation of chip modules with up to 40,000 modules/hour. PowerTest - Chip Module Test System The inspection of IC modules for smart cards and RFID devices, based on parametric and functional testing, is an integral part in the production flow and quality assurance. The PowerTest is designed for high-speed testing and encoding of chip modules on 35 mm tapes. The system is also perfectly suited for initialisation and personalisation of IC modules, including OS loading. GTL700 - Glue Tape Lamination System The GTL700 is a highly reliable and flexible system for glue tape lamination of chip module tapes in preparation for the hot melt implanting process. The very efficient system can...

Starting with the base polymer TECASINT 5011, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry. It has good electrical insulation properties and surface hardness, and also high rigidity. The glass transition temperature is 340°C, while the maximum service temperature may be – for a short time – up to 300 °C.

RAFI Eltec is a technical services provider that develops and produces electronic assemblies and systems according to customer-specific requirements – from the idea to the finished product. At RAFI Eltec, we test the quality of our products across all manufacturing processes. By performing individual tests and integrating fully automatic tests in combined assembly and testing lines, we achieve targeted and effective test cost reductions. For this purpose, we insist on the most cutting-edge technologies and high-quality equipment. Testing technologies - Pull test for chip-on-board - Automatic optical inspection - Flying probe - In-circuit test - Boundary scan test - Function test - Burn-in test and run-in test - Temperature shock test - Temperature humidity test You can rely on support from the right contact partner for you – whether you are approaching us for the first time or during the production process. We expertly answer all your questions.