3D-MICROMAC AG

- Formats from 1/2 to 1/6 cells and sizes up to M12 - Free-form cutting - Power increase of up to 2W through TLS technology 3D-Micromac's patented laser technology for direct cutting of solar cells is the leading method for cutting cells. When conventional cutting methods reach their limits, TLS technology with ultra-short pulses comes into play. Excellent cutting qualities with high reproducibility and accuracy can be guaranteed. Whether half-cell, third-cell, quarter-cell or the trend-setting six-cell. The great flexibility of TLS technology makes it possible to provide our customers with comprehensive support. Adaptation in the number of cell cuts, variation in the size of the substrates up to 220mm or a high flexibility in the freedom of shape. From silicon-based cell types such as PERC, TOPCon, HJT to IBC, the processing of your mono- and polychristaline photovoltaic cells is possible.

Applications: - Laser cutting, dicing, and filamentation - Laser drilling – available as trepanning or percussion process - Laser micro structuring and ablation, e.g. with FSLA technology - Laser micro engraving, both on the substrate surface and as sub surface engraving in transparent materials Laser-Lift-Off (LLO) using DPSS laser and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material

Applications: - Excimer Laser-Lift-Off using line-beam systems - Laser drilling and ablation using scanner systems or mask projection - Laser engraving of optical materials - Materials: polymers, polymer compounds, glass materials

Besides the processing of rigid and flexible materials on rigid substrates, we also offer the processing of flexible materials using sheet-to-sheet or roll-to-roll processes: - Laser micro structuring and ablation - Laser processing “on-the-fly” or “step and repeat” - Roll width up to 300 mm possible