DIENER ELECTRONIC GMBH & CO. KG

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Pico low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of 5 up to 8 litres of this plasma system offers enough space to serve laboratory and also series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Nano low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of 18 up to 24 litres of this plasma system offers enough space to serve laboratory and also series production. Plasma treatment in low-pressure plasma is a proven technique for controlled ultra-fine cleaning, improvement of adhesion (activation and etching) and coating of thin layers on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues. Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

A prerequisite for the adhesion of an adhesive or coating to a surface is wetting. For wetting to take place, the surface energy of the substrate must be greater than that of the coating. In particular, very many plastics have a very small surface energy and are correspondingly difficult to bond. Often the aim of a plasma treatment is to make a surface wettable and bondable. The wettability can easily be tested with test inks. Diener electronic supplies a test ink set with 8 liquids with surface tensions between 30 and 73 (105) mN/m suitable for most practical applications. There is also a set of 23 test inks, with additional gradations between 30 and 73 (105) mN/m.

The VC M1200² is based on our new modular chamber system. The system consists of individual, fully milled aluminum modules with a depth of 500mm. Thus the length of the chamber can be variably set in 500mm steps. ✓ Flexible length of max. 3 meters ✓ Very fast delivery because only door and back wall must be supplemented ✓ Low-cost ✓ Low-weight ✓ Low desorption of the aluminium, therefore also suitable for high vacuum ✓ Highly clean processes possible, e.g. in the semiconductor field ✓ Easy operation ✓ Easy attachment to the existing division bars Vacuum chamber specifications Internal dimensions Length: 1000 mm (modular in 500 mm steps) Width: 1200 mm Height: 1200 mm Connections 2 x KF 16 6 x KF 40 1 x ISO K 63 1 x ISO K 160 Additional flanges possible in any position

Vacuum degassing / outgassing With the aid of vacuum outgassing, unpleasant tastes or odors can be degassed and thus rendered tasteless. Altitude simulation For aircraft transport, it is essential to perform tests and simulations at a pressure <800 mbar, since in cargo holds, pressure equalization takes place, but cannot compensate for all fluctuations. Vacuum storage systems The safest way to store highly sensitive components is under vacuum. Under the vacuum environment, your components are protected from all external influences. Control and process control Our specially developed control program offers not only the possibility to monitor, but also to program and store various process sequences. High and ultra-high vacuum From the pressure range of rough vacuum to fine vacuum and ultra-high vacuum, we are able to meet your process requirements with our systems.

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Tetra 30 low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of 34 up to 50 litres of this plasma system offers enough space to serve series production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Plasma systems from Diener electronic have long since established themselves in a wide variety of industrial sectors. With the atmospheric pressure plasma system PlasmaBeam RT, you can rely on modern and future-proof plasma jet technology under atmospheric pressure. Due to the treatment width of 120 mm, substrates can be treated locally with precision. With our new product, the PlasmaBeam RT, there is now the perfect solution for fast, efficient and wide in-line plasma treatment of 2D surfaces. The RT can be perfectly integrated into existing production lines and thus enables the automated cleaning and activation of various components and web-shaped materials. We create the possibility of up to 120 mm wide plasma treatment, with the usual consistent quality and effectiveness of atmospheric pressure plasma systems from Diener electronic.

A cost-effective process for activating plastic and elastomer surfaces is treatment with the PlasmaAPC 500 DUO. Using air as the process gas, large surfaces can be activated under atmospheric pressure. An arc is ignited between two electrodes in an inhomogeneous field. The voltage is about 10,000 V. In the discharge zone, the air flowing through is ionised. The plasma is blown out of the electrode area by the air flow. The substrate can now be treated in the emerging corona. A strip several centimetres wide is treated in the corona. With several parallel plasma generators it is possible to treat surfaces. Due to dangerous voltage potential, PlasmaAPC 500 DUO is only suitable for non-conductive materials. PlasmaAPC 500 DUO is suitable as a pre-treatment unit for the following processes: Bonding, printing, painting. The following surfaces can be treated with PlasmaAPC 500 DUO: Plastics, rubber, ceramics, glass.

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Atto low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 10.5 litres of this plasma system offers enough space to serve laboratory and also small series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ...

The Vacuum Chamber VC P400x400 is made of a unique, flexible chamber system based on extruded aluminium profiles. The three meter long profiles are cut to the desired length and equipped with a bolted rear wall and a door. Slits are provided in the side walls of the profile for easy insertion of the product carriers. ✓ Flexible length of max. 3 meters ✓ Very fast delivery because only door and back wall must be supplemented ✓ Low-cost ✓ Low-weight ✓ Low desorption of the aluminium, therefore also suitable for high vacuum ✓ Excellent thermal conduction ✓ Highly clean processes possible, e.g. in the semiconductor field ✓ Easy operation ✓ Easy attachment to the existing division bars Vacuum chamber specifications Internal dimensions Length: up to 3000 mm (standard: 625 mm) Width: 400 mm Height: 400 mm Front panel (optional): 10 U (1 U = 44.45 mm) Connections 1 x KF 16 6 x KF 40 Additional flanges possible in any position