Dymax 9801

Low shrinkage optical camera module adhesive with LED and/or heatcure for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. Features: - Rapid LED or UV/Visible light and/or heat cure - Very low volumetric shrinkage - High Tg and Low CTE - Low ASTM E595 Outgassing - No frozen storage, refrigerated shipment/storage 15°C [3441° F]

Low shrinkage optical positioning Epoxy with LED and heatcure capability. Features: - Fast cure with LED or UV/Visible light - Low temperature heat cure (8085°C) - Low shrinkage and CTE - Single component - Cold ship/Cold storage at 15°C - Passes ASTM E595 Outgassing Testing

Dymax GA140 forminplace (FIP) and cureinplace (CIP) gasketing resin is formulated for fuel cell, automotive door handle, appliance housing, and critical electronic assembly and device applications which require a soft, tackfree, lowoutgassing, flexible gasket with compression set. Features: - Cures with UV/Visible light - Low outgassing - Cures soft and tack free - Excellent tear resistance - Clear in color - Cures in seconds - Silicone free - Conforms to intricate channels or recesses - Compliant with with RoHS directives 2015/863/EU

Plating, grit blast, and heatresistant Maskant with SeeCure Technology. Features: - Cures with UV/Visible light - See Cure dispenses blue, cures pink upon cure - Excellent surface protection - Complete under in 8 seconds - Easy peeloff after exposure to heat/hot water bath - Spray or dip application - Rolls Royce approval as metal spray maskant with designation of OMat 2/240 - Compliant with ISO 109935 Cytotoxicity - Compliant with with RoHS2 directives 2015/863/EU