Metal cutting - Import export

Metal In put into operation a machine for laser cutting of pipes with automatic loading and unloading. The size of the treated pipes is: Round pipes: 120 mm Rectangular tubes: 100x100mm The maximum length of the workplace is 6500mm. The machine is equipped with excellent software that allows different shapes in tubes for subsequent assembly and welding. Also, pipes can be cut so that one wall remains uncut, allowing it to bend easily and accurately and find a frame.

The company has 2 fiber lasers, with which it performs cutting both for its own needs and for customers. Our goal is to provide good service, which means fast response, excellent quality, competitive prices. Laser cutting machines are equipped with two removable replaceable tables measuring 1500 x 3000 mm and it is adapted for continuous three-shift mode. The maximum cutting thicknesses for the different materials are: Mild steel - 20 mm Stainless steel - 12 mm Aluminum - 12 mm Copper - 5 mm Bronze - 5 mm

We can facet blanks with a diameter up to150 mm, and also rectangular wafers. Facet dimension – up to 5 mm. Edge grinding accuracy 0,1 mm.

Wafers with maximum dimensions 200x200 mm are being lapped. Capacity – 1000 kg/month. Surface roughness – ˂ Ra 0.1

A squaring machine with two blades for outside cutting is used for this operation. Capacity – 2000 kg/month. It produces rectangular ingots with a maximum diagonal of 200 mm.

After the surface grinding, the crystal is sliced into wafers with a thickness according to customer’s specifications. Sawing machines with diamond impregnated blade are used for the slicing. We have got 5 sawing machines with a monthly capacity 2500 kg. Maximum diameter Ф152 mm. Wafer thickness up to 80 mm. Slicing accuracy ± 25 microns.

Depending on the customers’ orders, the crystals are being ground on the outside diameter of a diamond peripheral sawing disk. We have got three centre grinders with a total monthly capacity 2000 kg. Maximum ground diameter – Ф200 mm. Accuracy 0.03 mm. Surface roughness - Ra ˂ 0.25.

After having pulled the crystal out, it is placed in the sawing machine, where the initial and the end cone are being cut out. Thereafter, the cylindrical part is cut-to-length, as requested. Diamond discs for peripheral sawing are used for cutting.

We have got 3 pulling machins for monocrystalline Silicon by the Czochralski method with maximum diameter Ф165 mm. Production capacity – 1500 kg/month. Materials and consumables from proven producers in the industry are used in our production, which guarantees the production of crystals with required purity and properties. Our extensive production experience, in a combination with application of state-of-the-art technologies and practices, allows us to produce crystals of high purity and quality meeting the requirements of our customers.

The company is technologically capable of slicing of thin wafers from optical glass and semi-precious stones.

Wafer thickness(μm) standard >350 >400 >440 >500 minimum 300 350 380 420 Through-the-thickness accuracy(μm) standard ±15 ±20 ±20 ±20 Thickness deviation TTV (μm) maximum 10 15 20 25 standard <7 <10 <10 <12 ИWafer warp (μm) maximum 30 35 40 45 standard <15 <15 <20 <25

Full square 100х100 from Ф 135 mmPseudo-square 100х100 from Ф125 mm Pseudo-square 125х125 from Ф150 mm

We produce targets, both single pieces and complete sets Resistance – as per customer’s specifications

Resistance for mirrors

We have Laser cutting machine.We can cut details from all kinds of steel.

Latest model 2000W Fiber Laser Cutting Machine with IPG source for your needs. Carbon Steel up to 16 mm Stainless Steel up to 7mm Aluminum up to 6 mm Copper and Brass up to 4mm We have combined the laser machine with a 6+1 axis CNC Press Brake 3200/100T in order to meet your part or component manufacturing needs without interruptions to your supply chain.

Laser cutting of stainless steel, carbon steel, any metal and non-metal sheets like wood, plexiglass, mdf, and other material.