Printed circuits - Import export

The smallest electronic components, such as chips or connectors, present special challenges for electroplating coatings. In addition to the conductor pattern construction in the manufacturing of printed circuit boards, copper processes are used for filling blind microvias (blind holes) and metallizing through holes. Good metal distribution is necessary even with unfavorable geometry. The most important application areas are found in the automotive industry, telecommunications, and consumer goods industry, but also in the field of e-mobility.

Schlötter Systems Dr.-Ing. Max Schlötter GmbH & Co. KG is among the leading manufacturers of electroplating systems and surface treatment facilities. With more than 1,000 systems realized since 1957, we draw upon a wealth of experience in production-ready solutions. At Schlötter, we leverage our expertise in systems engineering and surface technology to precisely tailor each system to the coating processes required by our clients. We design and manufacture rack, barrel, and manual systems, modernize facilities, and support our customers with our systems technology services throughout the long lifespan of our systems. Rack systems Barrel systems Manual systems Electroplating systems Anodizing systems Cleaning and pickling systems Chemical systems Printed circuit board systems Plastic electroplating systems Schlötter Systems in All Surface Technology Industries Schlötter systems are utilized for a wide range of surface technology applications.

SELECTIO Selective soldering systems for automatic single point soldering and multiple point soldering It is not always possible to use mass soldering processes such as wave soldering to perform a certain soldering task. Individual soldering steps are often necessary. To automate this process and to lower the costs while maintaining the high quality requirements, STRECKFUSS SYSTEMS has developed the selective soldering system SELECTIO. Just like our wave soldering system TITANIUM, SELECTIO too is equipped with the corrosion and tin resistant agent titanium and therefore works perfectly for lead free soldering. Product characteristics – an overview: x/y/z- axes system with precision toothed drive belt transport system and assembly carrier standard stand- alone- system (offline system): optional transportation belt connection as inline system printed circuit board transportation with assembly carrier soldering processes: single point nozzle and surface nozzle as well as dip soldering via mask technique fluxing out of vendor's flux container with multi- drop- fluxer nozzle short wave IR- quartz- radiators for preheating of printed circuit boards pyrometer for contact- free temperature check of printed circuit boards easily exchangeable soldering nozzles Microsoft© Windows user surface and process visualization: - BDE for documentation complying with DIN ISO 9000 ff - management data organization - optional real- time video surveillance

TYP C 044/S Cutting, stamping and bending device for axial components Description To facilitate the placement of short axial leaded components that must be cut before insertion into the circuit board to the appropriate length and bent to the required height and - if necessary - marked . This axial taped components are processed in high- components. In the device 044 C / S to be bent, the components are manually inserted into the device and processed by triggering the pneumatic foot switch. The high- axial component can be provided either at one or at both terminal wires with a bead for preventing falling out of the printed circuit board according to the manual setting operation. Components

The press-fit connection provides an enduring mechanical and electrical connection between the printed circuit board and plug connectors. The Compliant Pin has many applications and our customers use them in a wide variety of products, including sensor and radar casings, electronic controllers, plug connectors, printed circuit board connectors and more. Advantages: — no complex soldering process — high mechanical stability — repairable — gas-tight connection at the point of contact

Aluminum composite foil bags, also known as aluminum vacuum bags, are produced in our production from highquality raw materials on fully automatic production lines and are characterized by the following properties Antistatic Waterproof Electrostatic shield Heat sealable The size of the bags is not fixed by default but rather can be implemented individually for our customers also as a 3in1 solution including tailormade desiccant and moisture indicator. Style and size are variable, such as flat bags, 3D bags, etc. The production takes place in strict accordance with the standards GB / T 10371988, GB / T 10382000, MILB81705C. Packaging of electronic components Packaging of printed circuit boards (PCB Packaging of integrated circuits (IC) Packaging of hard drives