Components- electronic - Import export

IMS (Insulated metal substrate) technology allows the mounting of power components directly on a highly thermally conductive printed circuit board . The result is a compact and reliable solution which, thanks also to the reduced cost compared to systems with traditional heat sinks, is finding more and more application in sectors where effective dissipation of the heat generated by electronic components is required, such as of Lighting, Automotive and Power Supply . The devices can operate at lower temperatures with a guarantee of greater reliability and lifespan , avoiding the assembly phases of mechanical heat sinks. The assembly cycle is simplified and can in some cases be reduced to just the SMT assembly operation. The availability of dielectric layers of different nature and thickness offers many design possibilities from a thermal and electrical insulation point of view. It is possible to use different materials with both aluminum and