Substrates - Import export

Peat products for hobby users in 20l, 45l, 70l bags for various uses

We know that the soil is as important as the seeds themselves or as the care of the plants. For this reason, we have developed a complete and extensive line of high quality and composition substrates suitable for the Spanish climate. Developed under scrupulous studies and trials with an exclusive formulation, balanced and concrete with an elegant, practical and very functional dress. FORMULATION High quality materials such as black peat, peat, coconut fiber, perlite, vermiculite ... get together to produce one material with excellent properties to form a suitable substrate for its function. PACKAGING The presentation in functional, complex plastic bags of high density and resistant to environmental conditions, makes of the Batlle substrates, a reference on outdoor lineal. Its chromatic range and ease of information facilitate the consumers decision. DESIGN The graphic creativity of the new range of substrates, has favored the clarity of information, visibility and the attractiveness

The CIEMHUS GROW substrate is designed to guarantee a spongy and ventilated environment, avoiding plant caking even in the advance phases of cultivation. The structure of this substrate facilitates a good circulation of air, water and fertilizer, supporting the plant growth. It contains a 10% of perlite, increasing the porosity of the substrate and allowing a better and faster plant rooting. It contains worm humus and the necessary nutrients to generate a complete ecosystem without needing additional fertilizers in the first weeks of cultivation. Both its structure and its fertilization, make this substrate the best ally for your cultivation. Packaging: 50L bags

Ceramic prined circuit board feature many advantages over metal core and FR4 circuit boards as they combine excellent thermal characteristics with low a expansion. They are also suitable for multilayer applications, show lower deformation, warpage and operate under higher temperatures. Elite advanced technologies is your partner for ceramic substrates and circuit boards. Thanks to our large laser facilities and patented printing technology we are able to accomodate both very tight tolerances as well as high volume production at a high quality.

Milled peat Fraction:0-20 mm Raw material: sphagnum black-brown peat Chemical characteristics: EC 1,0-1,8 mS/cm pH 5,5-6,5 (H2O) Additives: Limestone 4,5kg/m3 NPK Multimix 1,5 kg/m3 Wetting agent 0,1kg/m3 Radigen 0,1kg/m3

Milled peat Fraction:0-7 mm Raw material: sphagnum black-brown peat Chemical characteristics: EC 0,7-1,45 mS/cm pH 5,5-6,5 (H2O) Additives: Limestone 4,0kg/m3 NPK Multimix 0,9 kg/m3 Wetting agent 0,1kg/m3 Radigen 0,1kg/m3

The first issue, taken into account when producing the substrates for professional growers, are the peculiarities of the cultivation of plants and local natural conditions. Upon the customer’s request, block and milled raw produce peat and peat of varying fragmentation can be mixed according to the customer’s individual requirements, thus obtaining a unique structure of the substrate. Products intended for the professional market are packed in bags with a volume of 70, 250 and 300 litres or large bags with a volume ranging from 3 to 6 cubic metres.

Optigrun Extensive Single Layer Substrate M-light is used as drainable vegetation substrate for extensive single-layered green roofs; for roofs with low load reserves.

Optigrun Intensive Substrate I-heavy is used as a vegetation substrate for multi-layered intensive green roofs, on roofs with high load capacity; suitable for a broad plant species diversity.

Optigrun Intensive Substrate Urban Soil is used as a vegetation substrate for intensive multi-layered green roofs. Specifically designed for growing vegetables and berry bushes on garden roofs with 0 - 5° roof pitch.

Optigrun Intensive/Extensive Single Layer Substrate Optilith is used as a drainage and vegetation substrate on intensive and extensive single-layered green roofs; used for accumulation of excess water in a cistern with enhanced water purity requirements.

Optigrun Low Density Substrate L is used as a drainable and particularly lightweight vegetation substrate for extensive green roofs that have low load reserves and as a light supporting substrate in tall planters and planting beds.

Optigrun Aeration Substrate U-heavy is used as a drainable filler substrate beneath Optigrün Intensive Substrate I on intensive green roofs with high load capacity; high build-up.

Optigrun Aeration Substrate U-light is used as a drainable filler substrate beneath Optigrün Intensive Substrate I on intensive green roofs with low load capacity; higher build-up.

Optigrun Intensive Substrate I-light is used as a vegetation substrate for multi-layered intensive green roofs, on roofs with low load capacity; suitable for a broad plant species diversity.

Optigrun Lawn Substrate R is used preferably for lawn areas and intensive multi-layered green roofs with a roof pitch of 0 - 20°.

Optigrun Extensive Multi Layer Substrate E-heavy is used as a vegetation substrate for extensive green roofs with a multi-layered build-up, for pitched roofs with roof pitch > 5° and for roofs with high load capacity/reserve; suitable for a broad plant species diversity.

Optigrun Extensive Single Layer Substrate M-heavy is used as drainable vegetation substrate for extensive single-layered green roofs; for roofs with high load reserves.

The Aluminum oxide (Al2o3) 96% ceramic plates are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. Alumina ceramic substrate / plate specification: > 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc. > The thickness of ceramic plate ranges from 0.25 to 1.0mm Can be made according to your requirements.

Product Name:Aluminum Nitride Ceramic Substrate, AlN Ceramic Sheet Application:Often used in electrical and electronic fields requiring heat conduction, heat dissipation, insulation, high temperature resistance,high voltage breakdown resistance, high thermal conductivity, good stability. Product specifications: Conventional models are TO-220, 247, 264, 3P Range thickness: 0.25mm, 0.385mm, 0.5mm, 0.635mm, 0.8mm, 1mm, 1.5mm, 2mm, 3mm Product Advantages: Aluminum nitride ceramics have excellent thermal conductivity (7-10 times of alumina ceramics),low dielectric constant and dielectric loss, reliable insulation performance, excellent mechanical properties, non-toxic, high temperature resistance, chemical corrosion resistance, and the thermal expansion coefficient of silicon is similar, as a new generation of ceramic materials, more and more by people Attention and attention.

DPC (Direct Plated Copper) Mainly by evaporation,magnetron sputtering and other surface deposition process to carry on the substrate surface metallization,first under the condition of vacuum sputtering,titanium,and then is copper particles,the plating thickness,then finish making line with ordinary PCB craft,and then to plating/electroless deposition way to increase the thickness of the line, the preparation of DPC way contains vacuum coating,wet deposition,Exposure development, etching and other processes. Advantages: >In terms of shape processing, DPC ceramic plate needs to be cut by laser, the traditional drilling and milling machine and punch machine can not be accurately processed, so the combination force and line width is also more fine. >The crystal performance of the metal is good >The flatness is good >The line is not easy to fall off >The line position is more accurate,the line distance is smaller, reliable and stable, can be through the hole and other advantages.

The Aluminum oxide (Al2o3 96%) ceramic substrate are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. The Maximum dimension of ceramic plate is 138x138mm and the thickness of ceramic plate ranges from 0.25 to 1.0mm. Alumina Ceramic Substrate Features: > High reliablility and sfety; > High density and mechanical properties > High electrical and thermal loading perormances > Low dilelectic loss and other characteristics Alumina ceramic substrate / plate specification: 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc. Can be made according to your requirements.

Factory Custom Silicon Nitride Thermal Substrate for High Power Radiator Silicon Nitride (Si3N4) is 60% lighter than steel but strong enough to survive some of the most demanding applications in a variety of industries. This lightweight, high-strength ceramic material is used as an alternative to stainless steel, super alloys, tungsten carbides and first-generation ceramics such as Al2O3 and ZrO2. It offers excellent thermal shock resistance and high fracture toughness, compatibility with nonferrous metal melts, and improved structural reliability compared to other ceramic materials. Silicon Nitride (Si3N4) Characteristics: >Good thermal shock resistance >Creep resistance >Low density >High fracture toughness >High hardness and wear resistance >Electrical resistivity

AMB Ceramic Substrate is a method to realize the bonding of ceramic and metal by reacting a small amount of active elements Ti and Zr in filler metal with ceramics to form a reaction layer which can be wetted by liquid filler metal. Advantage: The combination is achieved by chemical reaction between ceramic and active metal solder paste at high temperature, so its bonding strength is higher and reliability is better. Disadvantage: The reliability of AMB process depends largely on the composition of active filler metal, brazing process, brazing layer structure and many other key factors。 Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)

DBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just lick PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)

Aluminum nitride ceramics have excellent electrical and thermal properties, and are considered to be the most promising high thermal conductivity ceramic substrate materials. In order to seal the package structure, mount components and connect input and output terminals, the surface and interior of the aluminum nitride ceramic substrate need to be metallized. The reliability and performance of ceramic surface metallization have an important impact on the application of ceramic substrates, and firm bonding strength and excellent air tightness are the most basic requirements. Considering the heat dissipation of the substrate, it is also required to have high thermal conductivity at the interface between the metal and the ceramic. The metallization methods on the surface of aluminum nitride ceramics include: thin film method, thick film method, high melting point metallization method, electroless plating method, direct copper cladding method (DBC), etc.

No other oxide ceramic material collectively exhibits these highly desirable properties and characteristics. BeO ceramic conducts heat more quickly than virtually all metals with the exception of copper and silver. Beryllia exhibits extremely low dielectric loss characteristics, possesses high electrical resistivity, and offers excellent strength with high specific stiffness properties. BeO provides all the desirable physical and dielectric characteristics exhibited by an aluminum oxide or aluminum nitride, in addition, offers thermal conductivity ten times higher than alumina, and fifty percent higher than aluminum nitride, a dielectric constant that is lower than both alumina and aluminum nitride, and weight per given volume that is fully a quarter less than alumina, and nearly ten percent less than aluminum nitride. As a thermally conductive and electrically insulating material, its performance is exceeded only by that of the diamond.

DBC ceramic substrate: Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to one or both sides by a high-temperature oxidation process (the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm of oxygen; under these conditions, a copper-oxygen eutectic forms which bonds successfully both to copper and the oxides used as substrates). The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it. 1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm 2.

The Aluminum oxide (Al2o3 ) ceramic rectangle substrate is widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. Alumina ceramic substrate / plate specification: > 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc. > The thickness of ceramic plate ranges from 0.25 to 1.0mm Can be made according to your requirements.