Pcb assembly - Import export

IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.

IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.

Bondable platinum 1000 Ohm RTD component Nominal resistance 1000 Ω at 0 °C Operating temperature range —50 °C to +150 °C TCR Pt 3850 ppm/K Chip size/dimensions 0.75 x 0.75 x 0.3 mm Tolerance/class IEC 60751 F0.3 (IST AG tolerance class B) Connection type Bondable pads (Au) Packaging Chip tray, sensor-side up

IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.

The wireless IST AG FlipChip series features Pt temperature sensors with excellent long-term stability, fast response time and low self-heating. The FlipChips are developed with contacts on one side resulting in no short-cut risk on the backside of the chip. Furthermore, IST AG offers different FC technologies for different assembly processes (reflow-soldering, bonding or welding). The FC sensors are available with accuracies of up to IEC 60751 F0.3 (IST AG reference class B) and in different dimensions (0603/0805/1206/further dimensions on request) with other dimensions available on request. The FC sensors are optimal for applications with limited space requirements and offer an optimal price/performance ratio. Due to the small mechanical dimensions, a standard 0805 FC will use the same space as a standard 0603 SMD sensor on a PCB.​

The wireless IST AG FlipChip series features Pt temperature sensors with excellent long-term stability, fast response time and low self-heating. The FlipChips are developed with contacts on one side resulting in no short-cut risk on the backside of the chip. Furthermore, IST AG offers different FC technologies for different assembly processes (reflow-soldering, bonding or welding). The FC sensors are available with accuracies of up to IEC 60751 F0.3 (IST AG reference class B) and in different dimensions (0603/0805/1206/further dimensions on request) with other dimensions available on request. The FC sensors are optimal for applications with limited space requirements and offer an optimal price/performance ratio. Due to the small mechanical dimensions, a standard 0805 FC will use the same space as a standard 0603 SMD sensor on a PCB.​